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<a name="x_m_7427086276612458678_x_Chapter1" style="font-family: Calibri, sans-serif; font-size: 11pt; color: inherit;"><b><span style="font-size:14.0pt; color:black">NAME:</span></b></a><span style="font-family: Calibri, sans-serif; font-size: 11pt;"></span><span style="font-family: Calibri, sans-serif; font-size: 12pt; color: black;"> Parham
Jafari</span><br>
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<b><span style="font-size:14.0pt; color:#201F1E">COMMITTEE CHAIR:</span></b><b><span style="font-size:12.0pt; color:#201F1E"> </span></b><span style="font-size:12.0pt; color:#201F1E">Dr. Hadi Ghasemi</span><span style="color:black"></span></p>
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<b><span style="font-size:14.0pt; color:#201F1E">DATE:</span></b><span style="font-size:12.0pt; color:#201F1E"> </span><span style="font-size:12.0pt; color:black">Tuesday, November 24, 2020</span><span style="color:black"></span></p>
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<b><span style="font-size:14.0pt; color:#201F1E">TIME</span></b><span style="font-size:14.0pt; color:#201F1E">:</span><span style="font-size:12.0pt; color:#201F1E"> 9</span><span style="font-size:12.0pt; color:black">:00 AM</span><span style="color:black"></span></p>
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<b><span style="font-size:14.0pt; color:#201F1E">LOCATION:</span></b><span style="font-size:12.0pt; color:#201F1E"> Zoom meeting ID: </span><span style="font-size:10.5pt; font-family:"Arial",sans-serif; color:#3C4043; letter-spacing:.15pt">955 2581 8556</span><span style="font-size:12.0pt; color:#201F1E"> (Please
email for passcode) - (<span style="color:rgb(96, 94, 92);font-family:"Segoe UI", "Segoe UI Web (West European)", "Segoe UI", -apple-system, BlinkMacSystemFont, Roboto, "Helvetica Neue", sans-serif;font-size:12px;background-color:rgb(255, 255, 255);display:inline !important">hghasemi@Central.UH.EDU</span>)</span><span style="color:black"></span></p>
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<b><span style="font-size:14.0pt; color:#201F1E">TITLE:</span></b><b><span style="font-size:12.0pt; color:#201F1E"> </span></b><span style="color:black"></span></p>
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<b><span style="font-size:14.0pt; color:#201F1E">On Physics of evaporation through AI-models, Boltzmann transport simulations, and experiments for extreme thermal management of electronics/photonics </span></b><span style="color:black"></span></p>
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<span style="font-size:12.0pt; font-family:"Times New Roman",serif; color:black">Evaporation is a fundamental and core phenomenon in a broad range of disciplines including power generation and refrigeration systems, desalination, electronic/photonic cooling,
aviation systems, and even biosciences. Evaporative mass flux is governed </span><span style="color:black">by the interfacial</span><span style="font-size:12.0pt; font-family:"Times New Roman",serif; color:black"> state of liquid and vapor phases. For closely
similar pressures and mass fluxes of liquid water into its own vapor, discontinuity between interfacial liquid and vapor temperatures in the range of 0.14-28 K is reported. This controversial discontinuity has resulted in an obstacle on understanding and theoretical
modeling of evaporation. Here, through study of vapor transport by Boltzmann transport equation solved through Direct Simulation Monte Carlo Method, we demonstrated that the measured discontinuities were strongly affected by boundary </span><span style="color:black">conditions</span><span style="font-size:12.0pt; font-family:"Times New Roman",serif; color:black"> on
the vapor side of the interface and do not reflect the interfacial state. The temperature discontinuity across the evaporating interface is ˜ 0.1 K for all these studies. To accurately capture the interfacial state, the vapor heat flux should be suppressed.</span><span style="color:black"></span></p>
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<span style="font-size:12.0pt; font-family:"Times New Roman",serif; color:black">The trend in miniaturization and enhanced functional performance of integrated circuits and power electronics and photonics has amplified the generated thermal energy in these
devices making thermal management a bottleneck for further advancement in these fields. A range of geometries of hierarchical structures are developed and examined to address this challenge. However, the numerous form factors and dimension of hierarchical
structures plus cost and time-consuming synthesis and test procedures make it infeasible to explore bountiful variations of hierarchical geometries through experimental methods. Here, we introduce a general Artificial Intelligence (AI) platform to address
this challenge and guide discovery of hierarchical structures for extreme thermal management of high-performance photonics/electronics. The AI platform is based on Random Forest (RF) algorithm, a robust AI method, and was trained using a large collected experimental
data set corresponding to thin film evaporation in various forms of hierarchical structures. Four geometrical dimensions of the hierarchical structures and two dimensionless numbers governing heat transfer and fluid dynamics were used as independent variables
to predict heat flux in these structures. The trained model's performance was analyzed and showed an excellent prediction of heat flux for all the structures with various working fluids.</span><span style="color:black"></span></p>
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