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</o:shapelayout></xml><![endif]--></head><body lang=EN-US link=blue vlink=purple><div class=WordSection1><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal align=center style='text-align:center'><b><span style='font-size:12.0pt;font-family:"Times New Roman","serif"'>M.S Thesis Defense Presentation<o:p></o:p></span></b></p><p class=MsoNormal align=center style='text-align:center'><b><i><span style='font-size:14.0pt;font-family:"Times New Roman","serif"'>Scale up of the process for Electrodeposition of low stress Permalloy film<o:p></o:p></span></i></b></p><p class=MsoNormal align=center style='text-align:center'><b><span style='font-size:12.0pt;font-family:"Times New Roman","serif"'>Rachit Sharma, MSIE Candidate<o:p></o:p></span></b></p><p class=MsoNormal align=center style='text-align:center'><b><span style='font-size:12.0pt;font-family:"Times New Roman","serif"'><o:p> </o:p></span></b></p><p class=MsoNormal align=center style='text-align:center'><span style='font-size:12.0pt;font-family:"Times New Roman","serif"'>Advisor: Dr. Ali Kamrani and Co-Advisor: Dr. Stanko Brankovic<o:p></o:p></span></p><p class=MsoNormal align=center style='text-align:center'><span style='font-size:12.0pt;font-family:"Times New Roman","serif"'>April 21<sup>st </sup>2011, at 2:30 pm, Industrial Engineering Conference Room<o:p></o:p></span></p><p class=MsoNormal align=center style='text-align:center'><span style='font-size:12.0pt;font-family:"Times New Roman","serif"'><o:p> </o:p></span></p><p class=MsoNormal align=center style='text-align:center'><b><span style='font-size:12.0pt;font-family:"Times New Roman","serif"'>Abstract<o:p></o:p></span></b></p><p class=MsoNormal style='text-align:justify'><span style='font-size:12.0pt;font-family:"Times New Roman","serif"'>Soft high magnetic moment alloys are used in production of magnetic recording heads and MEMS devices. Permalloy (Ni-80%, Fe-20% by weight), is a commonly used soft magnetic material in MEMS because of its high magnetic permeability, low coercivity, and near zero magnetostriction. During electrodeposition of Permalloy, residual stress is an undesired parameter which may cause effects such as delamination and cracks, affecting the working of the MEMS device. <o:p></o:p></span></p><p class=MsoNormal style='text-align:justify;text-indent:.5in'><span style='font-size:12.0pt;font-family:"Times New Roman","serif"'><o:p> </o:p></span></p><p class=MsoNormal style='text-align:justify'><span style='font-size:12.0pt;font-family:"Times New Roman","serif"'>In this project we have developed an electrodeposition bath which deposits Permalloy with low stress, desired magnetic properties and high corrosion resistance. We met the challenge of electrodepositing Permalloy on six inch wafer using 25 L of solution, meeting the industrial level requirement and producing films with the required composition, low stress and susceptibility to corrosion. We used Semitool-M-Raider Series tool to electroplate Permalloy on copper sputtered silicon wafers and studied the effects of parameters like flow rate, agitation velocity, agitation acceleration, etc on electrodeposition of Permalloy. We optimized each parameter respectively, to get rid of the standing wave seen on the initially plated wafers. We studied the variation in anode potentials, which affects the uniformity of deposition, to obtain the alloy with most uniform thickness. The residual stress in these electroplated wafers was measured using wafer bow measurement. The next step involves using the same scale up process to measure residual stress on different alloys and patterned wafers.</span><o:p></o:p></p><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Book Antiqua","serif";color:blue'>_______________________________________________________</span><o:p></o:p></p><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Book Antiqua","serif";color:blue'>Suresh K. Khator, Ph.D., P.E. Phone: 713-743-4205 <o:p></o:p></span></p><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Book Antiqua","serif";color:blue'>Associate Dean, College of Engineering Fax: 713-743-4214<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Book Antiqua","serif";color:blue'>University of Houston Email: skhator@uh.edu <o:p></o:p></span></p><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Book Antiqua","serif";color:blue'>E421 Engineering Bldg 2 www.egr.uh.edu/ie<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Book Antiqua","serif";color:blue'>Houston, TX 77204-4008<o:p></o:p></span></p><p class=MsoNormal><o:p> </o:p></p></div></body></html>