[CCoE Notice] (10:00 am US Central Time) Zoom Webinar: Efficient Plasmonic Circuits for Data Communications * 10:00 am, Friday, September 17 * Amr S. Helmy * The University of Toronto *
UH Cullen College of Engineering
ccoecomm at Central.UH.EDU
Mon Sep 13 11:50:32 CDT 2021
***** Seminar *****
Department of Electrical and Computer Engineering
Materials Engineering Program
Center for Integrated Bio and Nano Systems
10:00 a.m., September 17, 2021
Join Zoom Meeting
https://urldefense.com/v3/__https://zoom.us/j/845619943?pwd=QlZvYUV6M2dxNDkvNWxBd3F2YzdJZz09__;!!LkSTlj0I!WfoiSWJk4w7aopxBqh1uLF2XAUstwyeZkfhmsD2iRlTgIIunwyqp7Ef3Jg1t6UvggLg$ <https://urldefense.com/v3/__https://zoom.us/j/845619943?pwd=QlZvYUV6M2dxNDkvNWxBd3F2YzdJZz09__;!!LkSTlj0I!RY36v8rc0HmWFLiTTBHvwLA0IazEOlQxdQZC1QwuRSdYLO0ZgFA27Y6PryVryUiq6I-G0w$>
Meeting ID: 845 619 943
Password: 016104
Efficient Plasmonic Circuits for Data Communications
Amr S. Helmy
IEEE Photonics Society Distinguished Lecturer
Department of electrical and computer engineering
The University of Toronto
Abstract: In this talk we plan to discuss a novel class of nanoscale devices that address unmet performance demands for applications in data communications. The performance of emerging generations of high-speed, integrated electronic circuits is increasingly dictated by interconnect density and latency as well as by power consumption. To alleviate these limitations, data communications using photons has been deployed, where photonic circuits and devices are integrated on platforms compatible with conventional electronic technologies. Within the dominant platform; namely Si, dielectric waveguides confine light via total internal reflection. This imposes bounds on minimizing device dimensions and density of integration. Those bounds arise due to the diffraction limit and the cross-coupling between neighboring waveguides. Nanoscale Plasmonic waveguides provide the unique ability to confine light within a few 10s of nanometers and allow for near perfect transmission through sharp bends as well as efficient light distribution between orthogonally intersecting junctions. With these structures as a building block, new levels of optoelectronic integration and performance metrics for athermal transceivers with achievable bandwidths of 100s Gbps and detection sensitivity better than -55 dBs, will be overviewed in this talk. In addition, opportunities for the role that 2D materials may pay in propelling these record performance metrics even further will be projected.
[cid:23bc03ce-c401-4194-a995-0d817a6fa872]
Short Bio: Amr S. Helmy is a Professor in the department of electrical and computer engineering at the University of Toronto. Prior to his academic career, Amr held a position at Agilent Technologies - UK, between 2000 and 2004. At Agilent his responsibilities included developing lasers and monolithically integrated optoelectronic circuits. He received his Ph.D. and M.Sc. from the University of Glasgow with a focus on photonic fabrication technologies, in 1999 and 1994 respectively. He received his B.Sc. from Cairo University in 1993, in electronics and telecommunications engineering science.
His research interests include photonic device physics and characterization techniques, with emphasis on plasmonics, nonlinear and quantum photonics.
-------------- next part --------------
An HTML attachment was scrubbed...
URL: http://Bug.EGR.UH.EDU/pipermail/engi-dist/attachments/20210913/c44e30ce/attachment-0001.html
-------------- next part --------------
A non-text attachment was scrubbed...
Name: image.png
Type: image/png
Size: 715418 bytes
Desc: image.png
Url : http://Bug.EGR.UH.EDU/pipermail/engi-dist/attachments/20210913/c44e30ce/attachment-0001.png
-------------- next part --------------
A non-text attachment was scrubbed...
Name: ECE-Nanoseries-fy2021-9-17-Helmy.docx
Type: application/vnd.openxmlformats-officedocument.wordprocessingml.document
Size: 2193632 bytes
Desc: ECE-Nanoseries-fy2021-9-17-Helmy.docx
Url : http://Bug.EGR.UH.EDU/pipermail/engi-dist/attachments/20210913/c44e30ce/attachment-0001.bin
More information about the Engi-Dist
mailing list