[CCoE Notice] Masters Thesis - Defense

[Khator, Suresh]

CHEMICAL GROUTS USED FOR WATER LEAK CONTROL APPLICATIONS IN CONCRETE STRUCTURES

Mehmet Burak Kazez

Tuesday, November 29th at 1:00 pm, CEE Conference Room N-137

Committee Members: C. Vipulanandan - Professor of Civil Engineering, K.W. White - Professor of Mechanical Engineering, A. S. Ayoub - Associate Professor of Civil Engineering

Chemical grouts are used for water leak control applications by repairing cracks in concrete structures and other infrastructure facilities. In this study laboratory investigation was undertaken with polyurethane and epoxy grouts over a period of six months to evaluate their performance under various simulated physical and chemical environments under the grout test protocol developed by Center for Innovative Grouting Materials and Technology (CIGMAT) under the Environmental Technology Verification (ETV) program of Environmental Protection Agency (EPA).

Grouts were characterized based on their physical and mechanical properties, leaching of organics in water and bonding strength to wet and dry concrete substrates. Also the chemical resistances of the cured grouts were tested at pH 2, 7 and 10 for a period of 180 days and under 10 wet-dry cycles over a period of 140 days. The hydrophilic polyurethane grout had expansive characteristics during setting but the epoxy grout did not. The setting times for polyurethane and epoxy grouts were 2.5 and 40 minutes respectively. The compressive strength of epoxy grout increased with curing time from 6573 to 6660 psi from 3 to 28 days of curing. The bonding strength and mode of failures varied with the type of grout and the condition of the concrete substrate. Grout-concrete interactions were studied over a period of six months and a specially designed model tests were conducted to simulate concrete leak repair. Liquid transportation into grouts, tensile and compression stress-strain relationships for both grouts and pressure-time-temperature relationship for polyurethane grout was modeled.

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